Prime Minister Modi will inaugurate the groundwork for three semiconductor projects valued at ₹1.25 lakh crore.

Prime Minister Narendra Modi expressed that it would mark a significant milestone in India’s aspirations to establish itself as a prominent center for semiconductor manufacturing, describing it as a “memorable occasion.”

Today, Prime Minister Narendra Modi is scheduled to inaugurate three semiconductor projects valued at approximately ₹1.25 lakh crore via video conferencing. Additionally, he will deliver an address to the nation’s youth, as announced by the Prime Minister’s Office (PMO).

 

The initiation of three vital projects is on the horizon: the establishment of a Semiconductor fabrication facility within the Dholera Special Investment Region (DSIR) in Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facilities in Morigaon, Assam, and Sanand, Gujarat, are in the pipeline.

 

“On the 13th of March 2024, marks a significant milestone in India’s journey towards establishing itself as a prominent center for semiconductor manufacturing. In an announcement on X, Prime Minister Modi revealed plans to participate in the ‘India’s Techade: Chips for Viksit Bharat’ initiative. During this event, he will inaugurate three semiconductor facilities collectively valued at over Rs. 1.25 lakh crore.

 

One of the key aspects of this initiative is the involvement of students from more than 60,000 educational institutions. Modi encourages young individuals, especially those with a keen interest in technology, to actively engage in tomorrow’s event.”

 

According to the Prime Minister’s Office (PMO), the initiatives align with the Prime Minister’s goal of establishing India as a leading global hub for semiconductor design, manufacturing, and technological advancement. This endeavor aims to generate ample job prospects for the nation’s youth.

 

Tata Electronics Private Limited (TEPL) is set to establish a semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) as part of the Modified Scheme for semiconductor fabs in India. This landmark project, with an investment surpassing Rs. 91,000 crore, will signify the inauguration of India’s inaugural commercial semiconductor fab.

 

Tata Electronics Private Limited (TEPL) plans to spearhead the establishment of the Outsourced Semiconductor Assembly and Test facility in Morigaon. This initiative falls under the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), and is expected to receive an investment of approximately ₹27,000 crore.

 

The establishment of the OSAT facility in Sanand will be undertaken by CG Power and Industrial Solutions Limited as part of the Modified Scheme for Semiconductor Assembly, Testing, Marking, and Packaging (ATMP), involving an investment of around ₹7,500 crore.

 

These measures are set to bolster India’s semiconductor ecosystem, laying a robust groundwork for its expansion. They are anticipated to create job prospects for numerous young individuals in the semiconductor field and catalyze employment growth in related sectors like electronics and telecommunications.

 

 

 

 

 

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